HD74HC74P vs 933713380653 feature comparison

HD74HC74P Renesas Electronics Corporation

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933713380653 NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 3.90 MM, PLASTIC, MS-012AB, SOT-108-1, SO-14
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e4 e4
Length 19.2 mm 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 200 ns 265 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 3.9 mm
Base Number Matches 2 1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
fmax-Min 24 MHz

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Compare 933713380653 with alternatives