HD74HC73RPEL
vs
935190270112
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
SSOP
Package Description
SOP, SOP14,.25
PLASTIC, SSOP-14
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
6.2 mm
Load Capacitance (CL)
50 pF
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Max Frequency@Nom-Sup
24000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
1
Number of Bits
2
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SSOP
Package Equivalence Code
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, SHRINK PITCH
Packing Method
TR
Propagation Delay (tpd)
190 ns
240 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Width
3.95 mm
5.3 mm
Base Number Matches
1
2
JESD-609 Code
e4
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
fmax-Min
24 MHz
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