HD74HC573RP-EL
vs
HD74HC573P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HITACHI LTD
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
DIP
Package Description
SOP,
DIP, DIP20,.3
Pin Count
20
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G20
R-PDIP-T20
Length
12.8 mm
24.5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
145 ns
145 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
7.62 mm
Base Number Matches
2
2
Pbfree Code
Rohs Code
Load Capacitance (CL)
50 pF
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Package Equivalence Code
DIP20,.3
Prop. Delay@Nom-Sup
28 ns
Compare HD74HC573RP-EL with alternatives
Compare HD74HC573P with alternatives