HD74HC42RPEL
vs
TC74HC42AFN-TP1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP16,.25
SOP,
Pin Count
16
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
DECIMAL DECODER/DRIVER
DECIMAL DECODER/DRIVER
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
240
Prop. Delay@Nom-Sup
38 ns
Propagation Delay (tpd)
190 ns
180 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.95 mm
3.9 mm
Base Number Matches
1
1
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD74HC42RPEL with alternatives
Compare TC74HC42AFN-TP1 with alternatives