HD74HC4066FP
vs
74HC4053PW
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP14,.3
|
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G16
|
| Length |
10.06 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Normal Position |
NO
|
|
| Number of Channels |
1
|
2
|
| Number of Functions |
4
|
3
|
| Number of Terminals |
14
|
16
|
| Off-state Isolation-Nom |
50 dB
|
|
| On-state Resistance Match-Nom |
3 Ω
|
|
| On-state Resistance-Max (Ron) |
200 Ω
|
225 Ω
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP14,.3
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
23 ns
|
|
| Switch-on Time-Max |
23 ns
|
220 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
5.5 mm
|
|
| Base Number Matches |
2
|
3
|
| Signal Current-Max |
|
0.025 A
|
| Supply Current-Max (Isup) |
|
0.16 mA
|
| Switching |
|
BREAK-BEFORE-MAKE
|
|
|
|
Compare HD74HC4066FP with alternatives