HD74HC4066FP vs MC14052BCP feature comparison

HD74HC4066FP Renesas Electronics Corporation

Buy Now Datasheet

MC14052BCP onsemi

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP ONSEMI
Part Package Code SOIC DIP
Package Description SOP, SOP14,.3 PLASTIC, DIP-16
Pin Count 14 16
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST DIFFERENTIAL MULTIPLEXER
JESD-30 Code R-PDSO-G14 R-PDIP-T16
Length 10.06 mm 19.175 mm
Moisture Sensitivity Level 1
Normal Position NO
Number of Channels 1 4
Number of Functions 4 2
Number of Terminals 14 16
Off-state Isolation-Nom 50 dB 50 dB
On-state Resistance Match-Nom 3 Ω 70 Ω
On-state Resistance-Max (Ron) 200 Ω 1050 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP14,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260 235
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 4.44 mm
Supply Voltage-Max (Vsup) 6 V 18 V
Supply Voltage-Min (Vsup) 2 V 3 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Switch-off Time-Max 23 ns 700 ns
Switch-on Time-Max 23 ns 700 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 30
Width 5.5 mm 7.62 mm
Base Number Matches 3 2
ECCN Code EAR99
Samacsys Manufacturer onsemi
JESD-609 Code e0
Signal Current-Max 0.025 A
Switching BREAK-BEFORE-MAKE
Terminal Finish TIN LEAD

Compare HD74HC4066FP with alternatives

Compare MC14052BCP with alternatives