HD74HC393RP-EL
vs
74HC393D,653
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
SOP,
3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
UP
UP
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
8.65 mm
Load/Preset Input
YES
NO
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
ASYNCHRONOUS
ASYNCHRONOUS
Number of Bits
4
4
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
325 ns
190 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Width
3.95 mm
3.9 mm
Base Number Matches
2
2
Rohs Code
Yes
Manufacturer Package Code
SOT108-1
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
24000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Package Equivalence Code
SOP14,.25
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
fmax-Min
24 MHz
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