HD74HC368P
vs
MC74HC368AN
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HITACHI LTD
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Control Type
ENABLE LOW
ENABLE LOW
Family
HC/UH
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
Length
19.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.006 A
0.006 A
Number of Bits
6
6
Number of Functions
1
2
Number of Ports
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
24 ns
29 ns
Propagation Delay (tpd)
120 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.06 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
3
JESD-609 Code
e0
Power Supplies
2/6 V
Terminal Finish
Tin/Lead (Sn/Pb)
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