HD74HC366RP-EL vs GD74HC366D feature comparison

HD74HC366RP-EL Renesas Electronics Corporation

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GD74HC366D LG Semicon Co Ltd

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer RENESAS TECHNOLOGY CORP LG SEMICON CO LTD
Part Package Code SOIC
Package Description SOP,
Pin Count 16
Reach Compliance Code unknown unknown
Family HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 6 6
Number of Functions 1 1
Number of Ports 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 120 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm
Base Number Matches 2 3
HTS Code 8542.39.00.01
Control Type ENABLE LOW
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Package Equivalence Code SOP16,.25
Prop. Delay@Nom-Sup 38 ns
Terminal Finish Tin/Lead (Sn/Pb)

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