HD74HC366RP-EL
vs
GD74HC366D
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
LG SEMICON CO LTD
Part Package Code
SOIC
Package Description
SOP,
Pin Count
16
Reach Compliance Code
unknown
unknown
Family
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
9.9 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
Number of Bits
6
6
Number of Functions
1
1
Number of Ports
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
120 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
Base Number Matches
2
3
HTS Code
8542.39.00.01
Control Type
ENABLE LOW
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.006 A
Package Equivalence Code
SOP16,.25
Prop. Delay@Nom-Sup
38 ns
Terminal Finish
Tin/Lead (Sn/Pb)
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