HD74HC352RP-EL
vs
TC74HC258AF(TP1)
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
HITACHI LTD
|
TOSHIBA CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP,
|
0.300 INCH, PLASTIC, SOP-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
Length |
9.9 mm
|
10.3 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Number of Functions |
2
|
4
|
Number of Inputs |
4
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Propagation Delay (tpd) |
155 ns
|
35 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.9 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
5.3 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Load Capacitance (CL) |
|
150 pF
|
Output Characteristics |
|
3-STATE
|
Peak Reflow Temperature (Cel) |
|
240
|
Terminal Finish |
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HD74HC352RP-EL with alternatives
Compare TC74HC258AF(TP1) with alternatives