HD74HC32RP-EL vs TC74HC32AFN-TP1 feature comparison

HD74HC32RP-EL Renesas Electronics Corporation

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TC74HC32AFN-TP1 Toshiba America Electronic Components

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 125 ns 19 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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