HD74HC30T vs CD74HC30PWG4 feature comparison

HD74HC30T Renesas Electronics Corporation

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CD74HC30PWG4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC TSSOP
Package Description TSSOP, TSSOP, TSSOP14,.25
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm 5 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 1 1
Number of Inputs 8 8
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 165 ns 195 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 2 1
Rohs Code Yes
Samacsys Manufacturer Texas Instruments
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 39 ns
Schmitt Trigger NO
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

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Compare CD74HC30PWG4 with alternatives