HD74HC30RP-EL
vs
MC74HC30DR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
SOIC
Package Description
SOP,
SOP, SOP14,.25
Pin Count
14
Reach Compliance Code
unknown
unknown
Family
HC/UH
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
1
Number of Inputs
8
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
165 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
Base Number Matches
2
3
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Package Equivalence Code
SOP14,.25
Packing Method
TAPE AND REEL
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
53 ns
Schmitt Trigger
NO
Terminal Finish
Tin/Lead (Sn/Pb)
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