HD74HC259RP-EL
vs
74HC259PW,112
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
SOP,
|
4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
9.9 mm
|
5 mm
|
| Logic IC Type |
D LATCH
|
D LATCH
|
| Number of Terminals |
16
|
16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.95 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| Manufacturer Package Code |
|
SOT403-1
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
1:8 DMUX FOLLOWED BY LATCH
|
| Family |
|
HC/UH
|
| JESD-609 Code |
|
e4
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.004 A
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
1
|
| Number of Functions |
|
1
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
|
TRUE
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
56 ns
|
| Propagation Delay (tpd) |
|
255 ns
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Trigger Type |
|
LOW LEVEL
|
|
|
|
Compare HD74HC259RP-EL with alternatives
Compare 74HC259PW,112 with alternatives