HD74HC251P-E vs CD74HC251EE4 feature comparison

HD74HC251P-E Renesas Electronics Corporation

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CD74HC251EE4 Texas Instruments

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e4 e4
Length 19.2 mm 19.305 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 8 8
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 245 ns 370 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Samacsys Manufacturer Texas Instruments
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Number of Bits 2
Package Equivalence Code DIP16,.3
Packing Method TUBE
Power Supply Current-Max (ICC) 0.16 mA
Prop. Delay@Nom-Sup 21 ns

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