HD74HC238RP
vs
933714640652
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP16,.25
SO-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
Input Conditioning
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
9.9 mm
Load Capacitance (CL)
50 pF
Logic IC Type
OTHER DECODER/DRIVER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
38 ns
Propagation Delay (tpd)
190 ns
225 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
Base Number Matches
2
2
Pbfree Code
Rohs Code
JESD-609 Code
e4
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD74HC238RP with alternatives
Compare 933714640652 with alternatives