HD74HC221P vs TC74HC221AP feature comparison

HD74HC221P Renesas Electronics Corporation

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TC74HC221AP Toshiba America Electronic Components

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Length 19.2 mm 19.25 mm
Logic IC Type MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR
Moisture Sensitivity Level 1 1
Number of Data/Clock Inputs 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 300 ns 265 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Load Capacitance (CL) 50 pF
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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