HD74HC1G08CME-E
vs
935245670118
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
NEXPERIA
Part Package Code
SOIC
Package Description
TSSOP, TSSOP5/6,.08
TSSOP,
Pin Count
5
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Renesas Electronics
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e6
Length
2 mm
2.05 mm
Load Capacitance (CL)
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.002 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Prop. Delay@Nom-Sup
25 ns
Propagation Delay (tpd)
125 ns
135 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
1.25 mm
1.25 mm
Base Number Matches
1
2
Compare HD74HC1G08CME-E with alternatives
Compare 935245670118 with alternatives