HD74HC1G08CME
vs
MC74VHC1G08EDFT2G
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
RENESAS ELECTRONICS CORP
ON SEMICONDUCTOR
Part Package Code
SOIC
Package Description
CMPAK-5
TSSOP,
Pin Count
5
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
AHC/VHC/H/U/V
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e0
e3
Length
2 mm
2 mm
Load Capacitance (CL)
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.002 A
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Prop. Delay@Nom-Sup
25 ns
Propagation Delay (tpd)
125 ns
16.5 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
1.25 mm
1.25 mm
Base Number Matches
2
1
Factory Lead Time
2 Days
Date Of Intro
2018-06-25
Samacsys Manufacturer
onsemi
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare HD74HC1G08CME with alternatives
Compare MC74VHC1G08EDFT2G with alternatives