HD74HC1G08CME
vs
MC74VHC1G08DFR2
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
ON SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
SOT-353
|
| Package Description |
CMPAK-5
|
TSSOP, TSSOP5/6,.08
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
AHC/VHC
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e0
|
e0
|
| Length |
2 mm
|
2 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
AND GATE
|
AND GATE
|
| Max I(ol) |
0.002 A
|
0.008 A
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP5/6,.08
|
TSSOP5/6,.08
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
TR
|
| Prop. Delay@Nom-Sup |
25 ns
|
16.5 ns
|
| Propagation Delay (tpd) |
125 ns
|
16.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
NO
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare HD74HC1G08CME with alternatives
Compare MC74VHC1G08DFR2 with alternatives