HD74HC1G08CME vs MC74VHC1G08DFR2 feature comparison

HD74HC1G08CME Renesas Electronics Corporation

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MC74VHC1G08DFR2 onsemi

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP ON SEMICONDUCTOR
Part Package Code SOIC SOT-353
Package Description CMPAK-5 TSSOP, TSSOP5/6,.08
Pin Count 5 5
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AHC/VHC
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e0 e0
Length 2 mm 2 mm
Load Capacitance (CL) 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.002 A 0.008 A
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Prop. Delay@Nom-Sup 25 ns 16.5 ns
Propagation Delay (tpd) 125 ns 16.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 2 1

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Compare MC74VHC1G08DFR2 with alternatives