HD74HC1G04-EL vs 74HC1G04GW feature comparison

HD74HC1G04-EL Renesas Electronics Corporation

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74HC1G04GW NXP Semiconductors

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Part Life Cycle Code Contact Manufacturer Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description TSSOP, PLASTIC, SC-88A, 5 PIN
Pin Count 5 5
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e6 e3
Length 2 mm 2 mm
Logic IC Type INVERTER INVERTER
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 5
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 125 ns 135 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN BISMUTH Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 1 9
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
Samacsys Manufacturer NXP
Load Capacitance (CL) 50 pF
Max I(ol) 0.002 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP5/6,.08
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 30

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