Findchips: Compare HD74HC1G04 vs 74HC1G04GW,125

HD74HC1G04 vs 74HC1G04GW,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	RENESAS ELECTRONICS CORP	NXP SEMICONDUCTORS
Part Package Code	SOIC	TSSOP
Package Description	TSSOP,	PLASTIC, SC-88A, 5 PIN
Pin Count	5	5
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
Length	2 mm	2 mm
Logic IC Type	INVERTER	INVERTER
Number of Functions	1	1
Number of Inputs	1	1
Number of Terminals	5	5
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	NOT SPECIFIED	260
Propagation Delay (tpd)	125 ns	135 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	4.5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED	30
Width	1.25 mm	1.25 mm
Base Number Matches	5	1
Manufacturer Package Code		SOT353-1
JESD-609 Code		e3
Load Capacitance (CL)		50 pF
Max I(ol)		0.002 A
Moisture Sensitivity Level		1
Package Equivalence Code		TSSOP5/6,.08
Packing Method		TR
Prop. Delay@Nom-Sup		27 ns
Schmitt Trigger		NO
Terminal Finish		Tin (Sn)
	Logic » Gates	Logic » Gates