HD74HC1G00-EL
vs
935262777125
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
TSSOP,
TSSOP,
Pin Count
5
5
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
AHC
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
Length
2 mm
2 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
125 ns
14.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
1.25 mm
1.25 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD74HC1G00-EL with alternatives
Compare 935262777125 with alternatives