HD74HC175FP-E
vs
HD74LS375FPEL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP16,.3
Pin Count
16
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
LS
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e6
Length
10.06 mm
10.06 mm
Logic IC Type
D FLIP-FLOP
D LATCH
Moisture Sensitivity Level
1
1
Number of Bits
4
1
Number of Functions
1
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
75 °C
Operating Temperature-Min
-40 °C
-20 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
190 ns
27 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
2.2 mm
Supply Voltage-Max (Vsup)
6 V
5.25 V
Supply Voltage-Min (Vsup)
2 V
4.75 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL EXTENDED
Terminal Finish
TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
HIGH LEVEL
Width
5.5 mm
5.5 mm
Base Number Matches
1
1
Load Capacitance (CL)
15 pF
Max I(ol)
0.008 A
Package Equivalence Code
SOP16,.3
Packing Method
TR
Power Supply Current-Max (ICC)
12 mA
Prop. Delay@Nom-Sup
27 ns
Compare HD74HC175FP-E with alternatives
Compare HD74LS375FPEL with alternatives