HD74HC174FP vs MC74AC259DR2 feature comparison

HD74HC174FP Hitachi Ltd

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MC74AC259DR2 Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD MOTOROLA INC
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.3 SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AC
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.06 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D LATCH
Max Frequency@Nom-Sup 24000000 Hz
Max I(ol) 0.004 A 0.024 A
Moisture Sensitivity Level 1
Number of Bits 6 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 200 ns 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Trigger Type POSITIVE EDGE LOW LEVEL
Width 5.5 mm 3.9 mm
Base Number Matches 2 1
Additional Feature 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
JESD-609 Code e0
Packing Method TR
Prop. Delay@Nom-Sup 17 ns
Terminal Finish Tin/Lead (Sn/Pb)

Compare HD74HC174FP with alternatives

Compare MC74AC259DR2 with alternatives