HD74HC158T vs SN74AHC158DBRG4 feature comparison

HD74HC158T Renesas Electronics Corporation

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SN74AHC158DBRG4 Texas Instruments

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description TSSOP, SSOP, SSOP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AHC/VHC/H/U/V
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 5 mm 6.2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 140 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 5.3 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP16,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 9.5 ns
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare HD74HC158T with alternatives

Compare SN74AHC158DBRG4 with alternatives