HD74HC158RP
vs
HD74LS157FP-EL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HITACHI LTD
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP16,.25
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HC/UH
LS
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
9.9 mm
10.06 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
75 °C
Operating Temperature-Min
-40 °C
-20 °C
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
28 ns
Propagation Delay (tpd)
140 ns
14 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
2.2 mm
Supply Voltage-Max (Vsup)
6 V
5.25 V
Supply Voltage-Min (Vsup)
2 V
4.75 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL EXTENDED
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
5.5 mm
Base Number Matches
2
2
Pbfree Code
Rohs Code
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD74HC158RP with alternatives
Compare HD74LS157FP-EL with alternatives