Findchips: Compare HD74HC157T-EL vs HD74HC157TELL

HD74HC157T-EL vs HD74HC157TELL feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	RENESAS ELECTRONICS CORP	RENESAS ELECTRONICS CORP
Part Package Code	SOIC	TSSOP
Package Description	TSSOP,	TSSOP, TSSOP16,.25
Pin Count	16	16
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G16	R-PDSO-G16
Length	5 mm	5 mm
Logic IC Type	MULTIPLEXER	MULTIPLEXER
Number of Functions	4	4
Number of Inputs	2	2
Number of Outputs	1	1
Number of Terminals	16	16
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	155 ns	155 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	4.5 V	4.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	4.4 mm	4.4 mm
Base Number Matches	3	2
Pbfree Code		Yes
Rohs Code		Yes
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Package Equivalence Code		TSSOP16,.25
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		31 ns
Time@Peak Reflow Temperature-Max (s)		20
	Logic » Multiplexer/Demultiplexers	Logic » Multiplexer/Demultiplexers