HD74HC153FPEL
vs
CD54HC251H/3A
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
HARRIS SEMICONDUCTOR
Part Package Code
SOIC
Package Description
SOP, SOP16,.3
DIE,
Pin Count
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
X-XUUC-N16
Length
10.06 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
2
1
Number of Inputs
4
8
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SOP
DIE
Package Equivalence Code
SOP16,.3
DIE OR CHIP
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE
UNCASED CHIP
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
29 ns
Propagation Delay (tpd)
145 ns
370 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
20
Width
5.5 mm
Base Number Matches
1
2
Output Characteristics
3-STATE
Compare HD74HC153FPEL with alternatives
Compare CD54HC251H/3A with alternatives