HD74HC131FPEL vs HD74HC131FP feature comparison

HD74HC131FPEL Renesas Electronics Corporation

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HD74HC131FP Hitachi Ltd

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP HITACHI LTD
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.3 SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
Input Conditioning REGISTERED STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.06 mm 10.06 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER OTHER DECODER/DRIVER
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.3 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Prop. Delay@Nom-Sup 53 ns 53 ns
Propagation Delay (tpd) 265 ns 265 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.5 mm 5.5 mm
Base Number Matches 1 2
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20

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