HD74HC11FP
vs
TC74HC11AF-TP1EL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
End Of Life
Ihs Manufacturer
HITACHI LTD
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP14,.3
SOP,
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
10.06 mm
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
3
3
Number of Inputs
3
3
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
25 ns
Propagation Delay (tpd)
125 ns
21 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
2.2 mm
1.9 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
5.5 mm
5.3 mm
Base Number Matches
2
1
JESD-609 Code
e2
Terminal Finish
TIN COPPER/TIN SILVER
Compare HD74HC11FP with alternatives
Compare TC74HC11AF-TP1EL with alternatives