Findchips: Compare HD74HC113P vs 74HC107PW,118

HD74HC113P vs 74HC107PW,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	RENESAS ELECTRONICS CORP	NEXPERIA
Part Package Code	DIP	TSSOP
Package Description	DIP,	PLASTIC, TSSOP-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDIP-T14	R-PDSO-G14
Length	19.2 mm	5 mm
Logic IC Type	J-K FLIP-FLOP	J-K FLIP-FLOP
Number of Bits	2	2
Number of Functions	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Polarity	COMPLEMENTARY	COMPLEMENTARY
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	DIP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	190 ns	48 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	5.06 mm	1.1 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	4.5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	0.65 mm
Terminal Position	DUAL	DUAL
Trigger Type	NEGATIVE EDGE	NEGATIVE EDGE
Width	7.62 mm	4.4 mm
Base Number Matches	2	1
Rohs Code		Yes
Manufacturer Package Code		SOT402-1
Date Of Intro		1995-11-01
Samacsys Manufacturer		Nexperia
JESD-609 Code		e4
Load Capacitance (CL)		50 pF
Moisture Sensitivity Level		1
Packing Method		TR, 13 INCH
Peak Reflow Temperature (Cel)		260
Terminal Finish		NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s)		30
fmax-Min		60 MHz
	Logic » FF/Latches	Logic » FF/Latches