HD74HC109FP-EL
vs
MC74AC259DR2
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
MOTOROLA INC
Part Package Code
SOIC
Package Description
SOP,
SOP, SOP16,.25
Pin Count
16
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
10.06 mm
9.9 mm
Logic IC Type
J-KBAR FLIP-FLOP
D LATCH
Number of Terminals
16
16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
1.75 mm
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.5 mm
3.9 mm
Base Number Matches
2
4
HTS Code
8542.39.00.01
Additional Feature
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
Family
AC
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Number of Bits
1
Number of Functions
1
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Output Polarity
TRUE
Package Equivalence Code
SOP16,.25
Packing Method
TR
Prop. Delay@Nom-Sup
17 ns
Propagation Delay (tpd)
11 ns
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Trigger Type
LOW LEVEL
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