HD74HC109FP-EL vs MC74AC259DR2 feature comparison

HD74HC109FP-EL Renesas Electronics Corporation

Buy Now Datasheet

MC74AC259DR2 Motorola Semiconductor Products

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS TECHNOLOGY CORP MOTOROLA INC
Part Package Code SOIC
Package Description SOP, SOP, SOP16,.25
Pin Count 16
Reach Compliance Code unknown unknown
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.06 mm 9.9 mm
Logic IC Type J-KBAR FLIP-FLOP D LATCH
Number of Terminals 16 16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 1.75 mm
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.5 mm 3.9 mm
Base Number Matches 2 4
HTS Code 8542.39.00.01
Additional Feature 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
Family AC
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Number of Bits 1
Number of Functions 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE
Package Equivalence Code SOP16,.25
Packing Method TR
Prop. Delay@Nom-Sup 17 ns
Propagation Delay (tpd) 11 ns
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Trigger Type LOW LEVEL

Compare HD74HC109FP-EL with alternatives