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HD74HC109FP vs 74HC259DB,118 feature comparison

HD74HC109FP Hitachi Ltd

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74HC259DB,118 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description SOP, SOP16,.3 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.06 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-KBAR FLIP-FLOP D LATCH
Max Frequency@Nom-Sup 21000000 Hz
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Bits 2 1
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP16,.3 SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 220 ns 255 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 30
Trigger Type POSITIVE EDGE LOW LEVEL
Width 5.5 mm 5.3 mm
Base Number Matches 2 2
Manufacturer Package Code SOT338-1
Additional Feature 1:8 DMUX FOLLOWED BY LATCH
JESD-609 Code e4
Packing Method TR
Prop. Delay@Nom-Sup 56 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Logic » FF/Latches
Logic » FF/Latches

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Compare 74HC259DB,118 with alternatives