HD74HC08T-EL
vs
HD14093BFP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
TSSOP,
SOP,
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
4000/14000/40000
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
5 mm
10.06 mm
Logic IC Type
AND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Propagation Delay (tpd)
115 ns
250 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
2.2 mm
Supply Voltage-Max (Vsup)
6 V
18 V
Supply Voltage-Min (Vsup)
2 V
3 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
5.5 mm
Base Number Matches
1
1
Compare HD74HC08T-EL with alternatives
Compare HD14093BFP with alternatives