HD74BC245AFPEL-E
vs
HD74BC245AFP-EL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
HITACHI LTD
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
20
20
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
BCT/FBT
BCT/FBT
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e4
Length
12.6 mm
12.6 mm
Logic IC Type
BUS TRANSCEIVER
BUS TRANSCEIVER
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
7 ns
7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
2.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.5 mm
5.5 mm
Base Number Matches
1
2
Compare HD74BC245AFPEL-E with alternatives
Compare HD74BC245AFP-EL with alternatives