HD74BC244AT-EL vs TD74BC244P feature comparison

HD74BC244AT-EL Renesas Electronics Corporation

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TD74BC244P Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code SOIC DIP
Package Description TSSOP, DIP,
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family BCT/FBT BCT/FBT
JESD-30 Code R-PDSO-G20 R-PDIP-T20
Length 6.5 mm 24.6 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 7 ns 6.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4.4 mm 7.62 mm
Base Number Matches 2 1
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP20,.3
Power Supply Current-Max (ICC) 27 mA

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