HD74AC74T
vs
5962-87756012A
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HITACHI LTD
|
QP SEMICONDUCTOR INC
|
| Part Package Code |
SOIC
|
QLCC
|
| Package Description |
TSSOP, TSSOP14,.25
|
QCCN,
|
| Pin Count |
14
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES WITH 5V SUPPLY
|
|
| Family |
AC
|
AC
|
| JESD-30 Code |
R-PDSO-G14
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
5 mm
|
8.89 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
95000000 Hz
|
|
| Number of Bits |
1
|
8
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
14
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
TSSOP
|
QCCN
|
| Package Equivalence Code |
TSSOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER
|
| Propagation Delay (tpd) |
16 ns
|
16 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.905 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
4.4 mm
|
8.89 mm
|
| fmax-Min |
125 MHz
|
95 MHz
|
| Base Number Matches |
3
|
1
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare HD74AC74T with alternatives
Compare 5962-87756012A with alternatives