HD74AC259RP vs MC74AC259D feature comparison

HD74AC259RP Renesas Electronics Corporation

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MC74AC259D onsemi

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP ONSEMI
Part Package Code SOIC SOIC
Package Description SOP, SOIC-16
Pin Count 16 16
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO OPERATES WITH 5V SUPPLY 1:8 DMUX FOLLOWED BY LATCH
Family AC AC
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e0
Length 9.9 mm 9.9 mm
Logic IC Type D LATCH D LATCH
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 12 ns 17 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 6 V
Supply Voltage-Min (Vsup) 3 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type LOW LEVEL LOW LEVEL
Width 3.95 mm 3.9 mm
fmax-Min 95 MHz
Base Number Matches 4 6
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.012 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method RAIL
Peak Reflow Temperature (Cel) 235
Prop. Delay@Nom-Sup 17 ns

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