HD74AC259RP vs M38510/30106BEB feature comparison

HD74AC259RP Renesas Electronics Corporation

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M38510/30106BEB Philips Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP SIGNETICS CORP
Part Package Code SOIC
Package Description SOP, DIP,
Pin Count 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO OPERATES WITH 5V SUPPLY
Family AC LS
JESD-30 Code R-PDSO-G16 R-GDIP-T16
JESD-609 Code e0
Length 9.9 mm
Logic IC Type D LATCH D FLIP-FLOP
Number of Bits 1 1
Number of Functions 1 6
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 12 ns 52 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Trigger Type LOW LEVEL POSITIVE EDGE
Width 3.95 mm
fmax-Min 95 MHz 25 MHz
Base Number Matches 4 1
Screening Level MIL-PRF-38535 Class B

Compare HD74AC259RP with alternatives

Compare M38510/30106BEB with alternatives