HD74AC259RP
vs
54AC175FMQB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
DFP, FL16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES WITH 5V SUPPLY
|
|
| Family |
AC
|
AC
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.9 mm
|
9.6645 mm
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Number of Bits |
1
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Propagation Delay (tpd) |
12 ns
|
15 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2.032 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
LOW LEVEL
|
POSITIVE EDGE
|
| Width |
3.95 mm
|
6.604 mm
|
| fmax-Min |
95 MHz
|
95 MHz
|
| Base Number Matches |
4
|
1
|
| Load Capacitance (CL) |
|
50 pF
|
| Max Frequency@Nom-Sup |
|
95000000 Hz
|
| Max I(ol) |
|
0.012 A
|
| Package Equivalence Code |
|
FL16,.3
|
| Packing Method |
|
TUBE
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare HD74AC259RP with alternatives
Compare 54AC175FMQB with alternatives