HD74AC174T-EL
vs
MC74AC174DR2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MOTOROLA INC
Part Package Code
SOIC
SOIC
Package Description
TSSOP,
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ALSO OPERATES WITH 5V SUPPLY
Family
AC
AC
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
5 mm
9.9 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Propagation Delay (tpd)
12.5 ns
9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
6 V
Supply Voltage-Min (Vsup)
3 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
4.4 mm
3.9 mm
fmax-Min
100 MHz
100 MHz
Base Number Matches
2
5
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
70000000 Hz
Max I(ol)
0.012 A
Number of Bits
6
Package Equivalence Code
SOP16,.25
Packing Method
TR
Terminal Finish
Tin/Lead (Sn/Pb)
Compare HD74AC174T-EL with alternatives
Compare MC74AC174DR2 with alternatives