HD74AC174RPEL
vs
JM38510/75307BFA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
Package Description
SOP, SOP16,.25
DFP,
Pin Count
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
JESD-30 Code
R-PDSO-G16
R-GDFP-F16
Length
9.9 mm
9.6645 mm
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
70000000 Hz
Number of Functions
1
6
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DFP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
FLATPACK
Packing Method
TR
Propagation Delay (tpd)
12.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
2.032 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.95 mm
6.604 mm
fmax-Min
100 MHz
Base Number Matches
2
1
Number of Bits
1
Compare HD74AC174RPEL with alternatives
Compare JM38510/75307BFA with alternatives