HD74AC157TVELL
vs
74AHC157PW,118
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NXP SEMICONDUCTORS
Part Package Code
TSSOP
TSSOP
Package Description
TSSOP,
4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
Pin Count
16
16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
AHC/VHC/H/U/V
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
5 mm
5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
9 ns
21.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
Base Number Matches
1
2
Rohs Code
Manufacturer Package Code
SOT403-1
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max I(ol)
0.008 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP16,.25
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
11 ns
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Compare HD74AC157TVELL with alternatives
Compare 74AHC157PW,118 with alternatives