HD74AC157RP
vs
HD74HC157T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
HITACHI LTD
Part Package Code
SOIC
SOIC
Package Description
SOP,
TSSOP, TSSOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ALSO OPERATES AT 5V VCC NOMINAL
Family
AC
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
9.9 mm
5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
9 ns
155 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
3 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.95 mm
4.4 mm
Base Number Matches
2
2
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Package Equivalence Code
TSSOP16,.25
Prop. Delay@Nom-Sup
31 ns
Compare HD74AC157RP with alternatives
Compare HD74HC157T with alternatives