HD64F3337STF16 vs HD64F3337STF16 feature comparison

HD64F3337STF16 Renesas Electronics Corporation

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HD64F3337STF16 Hitachi Ltd

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP HITACHI LTD
Part Package Code QFP QFP
Pin Count 80 80
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Bit Size 8
CPU Family H8/300
JESD-30 Code S-PQFP-G80 S-PQFP-G80
Number of Terminals 80 80
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min -20 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP TFQFP
Package Equivalence Code TQFP80,.55SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
RAM (bytes) 2048
ROM (words) 61440
ROM Programmability FLASH FLASH
Speed 16 MHz 16 MHz
Supply Current-Max 60 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 1
Package Description TFQFP,
Has ADC YES
Address Bus Width 16
Clock Frequency-Max 16 MHz
DAC Channels YES
DMA Channels NO
External Data Bus Width 8
Length 12 mm
Number of I/O Lines 66
PWM Channels YES
Seated Height-Max 1.2 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Width 12 mm