HD64F3048VF8
vs
HD64F3048VF8
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
HITACHI LTD
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP-100
|
QFP-100
|
Pin Count |
100
|
100
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Has ADC |
YES
|
YES
|
Address Bus Width |
24
|
24
|
Bit Size |
16
|
16
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
8 MHz
|
8 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
JESD-609 Code |
e4
|
|
Length |
14 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
78
|
78
|
Number of Terminals |
100
|
100
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
FQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM (words) |
131072
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
3.05 mm
|
3.05 mm
|
Speed |
8 MHz
|
8 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.7 V
|
2.7 V
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
1
|
|
|
|