HD6473837UFV
vs
HD6473837UF
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP,
|
QFP,
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
OPERATES AT 2.7V MINIMUM SUPPLY @ 500 KHZ
|
OPERATES AT 2.7V MINIMUM SUPPLY @ 500 KHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
5 MHz
|
5 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
| JESD-609 Code |
e6
|
e0
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
84
|
84
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
OTPROM
|
OTPROM
|
| Seated Height-Max |
3.1 mm
|
3.1 mm
|
| Speed |
5 MHz
|
5 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4 V
|
5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN BISMUTH
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
2
|
| On Chip Program ROM Width |
|
8
|
| ROM (words) |
|
61440
|
|
|
|