HD6473297VC10
vs
HD6473297VP10
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HITACHI LTD
|
HITACHI LTD
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
WSDIP,
|
SDIP,
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
10 MHz
|
10 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-CDIP-T64
|
R-PDIP-T64
|
| Length |
57.3 mm
|
57.6 mm
|
| Number of I/O Lines |
51
|
51
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
WSDIP
|
SDIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE, WINDOW, SHRINK PITCH
|
IN-LINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
UVPROM
|
OTPROM
|
| Seated Height-Max |
5.6 mm
|
5.08 mm
|
| Supply Current-Max |
40 mA
|
40 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
1.778 mm
|
1.778 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
19.05 mm
|
19.05 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|