HD6473214F16
vs
HD6473214F16
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
HITACHI LTD
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP, QFP64,.66SQ,32
|
|
Pin Count |
64
|
64
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
CPU Family |
H8/300
|
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
JESD-609 Code |
e0
|
e0
|
Length |
14 mm
|
14 mm
|
Number of I/O Lines |
53
|
53
|
Number of Terminals |
64
|
64
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
75 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
QFP64,.66SQ,32
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
1024
|
|
ROM (words) |
32768
|
32768
|
ROM Programmability |
OTPROM
|
OTPROM
|
Seated Height-Max |
3.05 mm
|
3.05 mm
|
Speed |
16 MHz
|
16 MHz
|
Supply Current-Max |
60 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Boundary Scan |
|
NO
|
|
|
|